Semiconductor

Silicon Wafer Edge Polisher

Because of its capability to increase throughput and improve surface precision in the wafer manufacturing process, the Mipox silicon wafer edge polisher is now found all over the world. This edge polisher, compatible with 6, 8, or 12 inch wafers, uses polishing tape with a fixed-abrasive; the tape is made by our own special manufacturing method and can be fed through the machine during polishing, making it possible to constantly polish with a new abrasive surface and also give a consistent polishing capability.

Silicon Wafer Edge Polisher

  • High throughput for any type of wafer
  • Improves surface precision
  • Chemical free polishing
  • Removes various types of films
  • Can be introduced at any stage of the wafer manufacturing process

We have sold over 130 edge polisher all over the world. This edge polisher, compatible with half inches to 12 inch wafers, uses polishing tape with a fixed-abrasive; the tape is made by our own special manufacturing method and can be fed through the machine during polishing, making it possible to constantly polish with a new abrasive surface and also give a consistent polishing capability.

 

  Bevel mechanism diagram
   

 

  Notch mechanism diagram
    

Specifications (TUNeDGE HT-301NB)

Dimensions 2300mm(H)×1620mm(W)×2015mm(D)
Weight Approx. 2,500Kg
Power supply, Power voltage AC200V/220V 3φ 50Hz/60Hz 50A
Required water pressure 0.2~0.4Mpa(~4L/min)
Required air pressure 0.5~0.8Mpa
Consumption 20NL/min