Customised Development & Polishing Services
Mipox provides customized development and polishing services for surface to edge polishing with capability to match customer requirements from geometries to surface finishes.
- With our lineup of polishing consumables and wide range of polishing know-how, we can provide our optimized solution.
- We can provide solutions from small lot to high-volume, consumables, polishing machines, process and technology.
- Our process development engineer will provide direct input to your needs.
- We have wide range of inspection equipment to analyze the quality before and after polishing.
Mipox grinding film test for SiC (Chamfer Creation)
Semiconductor wafer size-down service
Mipox provides size-down (resizing) service for various semiconductor wafers. Please feel free to contact us for further specification.
Wafer material：Si, Glass, SiC
Possible wafer diameter：φ4inch to φ12inch
After processing：φ2inch to φ12inch
*Mipox also provides edge beveling and polishing services. This process contributes to the yield of the post-process (e.g. Back grinding) by removing chipping from the wafer edge.